Hong Kong captures half of global digital bond issuance in H1 2026
HKMA Speech

Hong Kong captures half of global digital bond issuance in H1 2026

Hong Kong Monetary Authority Chief Executive Eddie Yue outlined a four-pillar strategy to expand the bond market across renminbi liquidity, market linkages and digital assets at the Treasury Markets Summit. The city captured half of global digital bond volume in the first half of 2026.

From Dim Sum to Wonton bonds

Hong Kong arranged 25 percent of all international bond issuances across Asia last year, securing the top regional ranking for nine of the past ten years.

Eddie Yue reported that debut issuances are driving expansion, with 55 percent of first-time Asian international issuers choosing the city.

Hong Kong dollar-denominated Wonton bond issuances surged 64 percent year-on-year in the first half of 2026.

To deepen liquidity, the HKMA and the People's Bank of China expanded the RMB Business Facility quota to 500 billion yuan with tenors up to three years.

The authority is also preparing a seven-day offshore renminbi liquidity tendering mechanism alongside short-term debt instruments.

On-chain settlement and global links

Hong Kong issued half of the world's digital bonds by volume in the first half of 2026.

The HKMA is now testing the tokenisation of Exchange Fund Bills while developing CMU OmniClear into a platform capable of round-the-clock atomic settlement against central bank digital currencies, tokenised deposits and regulated stablecoins.

Cross-border links have expanded to include the Central Bank of the United Arab Emirates and Switzerland's SIX.

HKEX will also introduce Bond Connect collateral usage.

Ambitious plumbing, untested demand

Hong Kong is aggressively upgrading its market plumbing to cement its offshore renminbi dominance.

Expanding depository links and collateral mechanisms addresses genuine operational friction for cross-border traders.

Yet the ambitious push into tokenised debt will only pay off if private secondary market trading follows.

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