HKMA to re-open 10-year government bond tender on January 14

The Hong Kong Monetary Authority will offer an additional HK$1.0 billion of its existing 10-year Government Bond issue, identified as 10GB3507001, under the Infrastructure Bond Programme.

These bonds are set to mature on July 24, 2035, carrying an annual interest rate of 3.17 percent, payable semi-annually in arrear.

As of January 8, 2026, the indicative pricing for these bonds stands at 100.60, reflecting an annualised yield of 3.121 percent.

This re-opening aims to expand the outstanding amount of this specific bond issue, providing further investment opportunities within the Hong Kong dollar institutional government bond market.

The tender process is a key mechanism for managing the HKSAR Government's debt portfolio and funding infrastructure projects.

Participation in the tender is exclusively limited to Primary Dealers appointed under the Infrastructure Bond Programme.

Interested parties not designated as Primary Dealers must submit their applications through one of these authorized dealers.

Each individual tender must be for a minimum amount of HK$50,000 or any integral multiple thereof.

The tender process will run from 9:30 am to 10:30 am on January 14, 2026, with settlement scheduled for January 15, 2026.

Proceeds from these bonds are earmarked for investment in infrastructure projects, aligning with the Infrastructure Bond Framework.